Resources & Support
Your Source For Information About Our Ever Changing Industry.
The semiconductor industry is complicated and constantly evolving. CyberOptics Semiconductor continually strives to make important product contributions to advance precision measurement of semiconductor equipment and processes while providing access to current information on a variety of valuable industry subjects.
For technical questions about specific CyberOptics Semiconductor products, please contact technical support.
Organization and Publication Links
Links to websites for prominent organizations and trade publications within the semiconductor industry.
Recent Technical Articles
Real-Time Vibration
Monitoring Optimizes
200 mm Equipment
Productivity, Fab Engineering & Operations, May 2008. Increased equipment productivity is key
for 200 mm fabs to realize profitability goals.
This is true especially because some products
won’t be transitioned to 300 mm production;
therefore, equipment at these 200 mm fabs
will need to keep running at optimum levels
to reduce wafer scrap and achieve maximum
yields. It is becoming increasingly imperative
that process and equipment engineers be
armed with a new set of solutions for monitoring
equipment vibration and acceleration
that provides a better feedback loop for
controlling equipment conditions in order
to accelerate yield improvements, and to
reduce machine downtime. Link to the full article
Improving wafer manufacturing in the nanotech age, EuroAsia Semiconductor, Nov 2007
Dennis Bonciolini, Chief Technology Officer, CyberOptics Semiconductor looks at how wafer manufacturing can be improved today by acknowledging legacy inefficiencies and maintaining tighter control on process specifications. Link to the full article
WaferSense®
Application Notes
Did you know that fab evaluations of wireless WaferSense® devices indicate ROI is often achieved after a single use? Read these application notes to learn about the return on investment you gain when you use WaferSense products to help you track and control previously unavailable parameters affecting your yields.
- WaferSense AGS: Gap Measurement With Repeat Test
- WaferSense ATS: Tokyo Electron Limited ACT Robot Teaching
- WaferSense ATS: Applied Materials Endura/Centura Robot Teaching
- WaferSense AGS: Applied Materials Precision 5000 Susceptor Leveling
- WaferSense AGS: Applied Materials Producer Heater-Susceptor Leveling
White Papers & Case Studies
CyberOptics Semiconductor offers downloadable white papers that focus on some of the most significant topics in the semiconductor industry. Subjects include wafer mapping and automatic alignment.
- Diffusion Group Traces Reduced Yield to Vibration Sources and Wafer Leveling
- PECVD Team Improves Tool Availability 60%, Film Uniformity with Wireless Showerhead Gapping
- Fab Establishes Co-Planarity Across Vertical Diffusion Process to Reduce Wafer Particle Contamination, Improve Yield
- Using WaferSense Auto Teaching Sensor (ATS) on 200mm and 300mm TEL Track ACT and Mark Tools
- WaferSense AVS Case Study: Fab Establishes PM Schedules, Improves Die Yield by Monitoring Equipment Vibration in Real-Time
- WaferSense ATS Case Study: Increasing Uptime of Endura/Centura Tool Sets and Film-Deposition Uniformity
- Demonstration Results for CyberOptics WaferSenseTM ALS2 (Auto-Leveling Wafer) on 200mm GSD-HE and Varian E500EHP Implanters.
- Achieve repeatability and precision with our Process and Uniformity Standards.
- Improve your alignment techniques with our paper on Automatic Alignment.
FAQs
CyberOptics Semiconductor provides answers to the most commonly asked questions about WaferSense precision measurement products and wafer mapping sensors.