White Papers
Solving Semiconductor Equipment Leveling Problems and Establishing Process Uniformity Standards
In order for semiconductor process equipment to operate efficiently, very precise leveling standards are needed for all wafer process and transfer locations. However, when asked about the leveling standard at their fab most process or equipment maintenance engineers responded, “we have no leveling standards.” It is inherently difficult to measure the inclination of semiconductor process equipment as access to the equipment may be limited and traditional leveling methods, including eyeballing and bubble levels, do not have the precision or repeatability required to establish leveling standards.
CyberOptics Semiconductor offers a look at the evolution of various alignment techniques, focusing on faster speeds, greater flexibility, higher accuracy and lower costs. Lighting options, camera choices and image processing techniques are also covered, along with lessons learned from current practices to assure productive and more profitable machine vision design.