WaferSense® Fabrication Uses
With the leading edge of the industry advancing production to the 65nm and 45nm nodes, and developments at the 32nm and 22nm nodes, it is increasingly critical that tool and process reproducibility be controlled to tolerances never previously required.
To satisfy these requirements, CyberOptics Semiconductor developed WaferSense™, a product line based on wireless technology that facilitates precision measurements of equipment and processes throughout the fab.
This trend to wireless precision metrology makes it possible to control parameters within the semiconductor fabs as never before, and will continue to gain importance and spawn new developments. WaferSense will be an enabling technology as fabs look to reproduce tighter dimensional tolerances within advanced processes. The result will be better control of robotics as well as control of direct process parameters, improving yield learning cycles and accelerating yield stabilization.
The cost of wafer scrap and maintenance downtime will continue to drive the desire to control process and equipment to tighter levels, and as other problems arise that were insignificant to processes above 100nm, process and equipment engineers will drive new ways to apply precise, wireless, real-time and minimally disruptive metrology throughout the fab. The opportunities have only begun to be tapped.
Photolithography
ALS is used to level and set co-planarity of load ports, robots, end effectors, spin cups, pedestals, and lift pins in coater developer track tools. View Product Information
ALSR is being used to level reticle stockers. View Product Information
ATS uses in Photolithography have been increasing, primarily being used to quickly and precisely teach placements of wafers within the track tool stations. View Product Information
AGS uses in Photolithography have not been highlighted at this time but possible uses would be to check gaps of robot blades to other wafer locations in FOUPs. View Product Information
Etch
ALS is used in Etch to level and set co-planarity of load ports, robots and end effectors, as well as leveling the wafer electrode and lift pins. View Product Information
AGS uses in Etch focus primarily at setting gap and parallelism of the electrodes in the etch chambers under vacuum conditions for better process control. View Product Information
ATS uses in Etch are for setting the robot wafer placements and teaching positions to the electrode center for consistent process uniformity and control. View Product Information
CMP
ALS uses in CMP include: leveling and setting co-planarity of load ports, robots, end effectors as well as platen leveling. View Product Information
AGS uses in CMP have not been reported, however possible applications exist in setting the gap and parallelism of the platens. View Product Information
ATS can be used to teach wafer transfer coordinates. View Product Information
Diffusion
ALS is being extensively used in Diffusion to level and set co-planarity of load ports, robots and boats in vertical furnaces. ALS conveniently and accurately sets perpendicularity of tall diffusion boats. View Product Information
AGS uses in Diffusion have not been highlighted at this time but possible uses would be to check gaps of robot blades to other wafer locations in FOUPs. View Product Information
ATS uses in Diffusion are for setting the robot wafer transfer coordinates and teaching positions to boats for reducing contamination and improved yields. Accurate teaching helps avoid wafer breakage. View Product Information
Thin Films
ALS uses in Thin Films include: leveling and setting co-planarity of load ports, robots, end effectors, aligners and stockers, as well as leveling the wafer pedestals and lift pins. View Product Information
AGS uses in Thin Films focus primarily at setting gap distances and parallelism of the electrodes in the deposition chambers under vacuum conditions for better process control and repeatability. View Product Information
ATS uses in Thin Films are for setting the robot wafer placements and teaching positions to the electrode center for consistent process uniformity and control. View Product Information
Implant
ALS is being extensively used by Implant engineers to level and set co-planarity of load ports, robots, end effectors and for leveling Implant Disks. View Product Information
AGS uses in Implant have not been reported, however possible applications may exist. View Product Information
ATS can be used to teach wafer transfer coordinates. View Product Information
Metalization
ALS is used during Metalization to level and set co-planarity of load ports, robots and end effectors as well as controlling the inclination of the wafer during plating tool setup. View Product Information
AGS uses in Metalization have not been reported, however possible applications may exist. View Product Information
ATS can be used to teach wafer transfer coordinates. View Product Information
Metrology
ALS is used in Metrology to level and set co-planarity of load ports, robots, end effectors and inspection tool stages. View Product Information
AGS uses in Metrology have not been reported, however possible applications may exist. View Product Information
ATS can be used to teach wafer transfer coordinates. View Product Information
Fab Automation
ALS is used during Fab Automation to level and set co-planarity of load ports, robots, end effectors, aligners, FOUP stockers, as well as FOUP transport system checks and setups. View Product Information
AGS uses in Fab Automation have not been reported, however possible applications may exist. View Product Information
ATS uses in Fab Automation have not been reported, however possible applications may exist. View Product Information
Reticle Manufacturing
ALSR is used during Reticle manufacturing to level and set co-planarity of the coating, developing and cleaning stations. View Product Information
ALSR also useful for leveling the reticle stocker. View Product Information








